(CANCELLED) IC 009. US 021 023 026 036 038. G & S: Optical, electric and electronic equipment for the processing and testing of electronic, micromechanical and optomechanical components and in particular semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition

(CANCELLED) IC 037. US 100 103 106. G & S: Installation, repair and maintenance of the machines for the production, processing and testing of electronic, micromechanical and optical components, and of the optical, electrical and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and, in particular, semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; installation, repair and maintenance of cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; installation, repair and maintenance of wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; installation, repair and maintenance of probed apparatus equipped with a laser cutter or emission microscopes and working with software; installation, repair and maintenance of test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, flexible tools for pattern recognition

(CANCELLED) IC 042. US 100 101. G & S: Technical support services, namely, development of new technology for others in the field of microtechnology; design and testing for new product development; installation and maintenance of software for pattern recognition