IC 002. US 006 011 016. G & S: Inks for use in the process of producing printed circuit boards, namely, marking inks, etching resist inks, printing inks, hole plugging inks, and solder resist inks; inks for printing in the process of producing package application boards; inks for printing in the process of producing flexible printed boards; inks for printing in the process of producing display panels; and coating for use in the process of producing printed circuit boards, namely, interlayer insulating coating, namely, interlayer insulating coating for use in the process of producing package application boards; interlayer insulating coating for use in the process of producing flexible printed boards; and interlayer insulating coating for use in the process of producing display panels, namely, build-up substrate thermal curable interlayer insulating coating, build-up substrate interlayer insulating coating, and thermal curable interlayer insulating coating. FIRST USE: 20090618. FIRST USE IN COMMERCE: 20090618

IC 017. US 001 005 012 013 035 050. G & S: Electrical insulating materials for use in coating or printing in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; insulating coating materials for use in the process of producing display panels; insulating materials for providing solder mask in the process of producing printed circuit boards; interlayer insulation materials for use in the process of producing build-up boards, namely, liquid resin, resin film, resin coated copper foil, pre-preg; and interlayer insulation materials for use in the process of producing printed circuit boards, namely, liquid resin, resin film, resin coated copper foil, pre-preg. FIRST USE: 20090618. FIRST USE IN COMMERCE: 20090618