IC 040. US 100 103 106. G & S: Assembly for others of wafers, chips, semiconductors and integrated circuits; assembly for others of integrated circuits, masks, and electronic chips or computer chips; custom cutting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom photo lithograph printing of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom etching of wafers, chips, semiconductors and integrated circuits; custom thin filming of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom diffusion ion implanting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom chemical mechanical polishing of wafers, chips, semiconductors and integrated circuits to the order and specification of others. FIRST USE: 19950526. FIRST USE IN COMMERCE: 20040430
26.03.28 - Miscellaneous designs with overall oval shape, including amoeba-like shapes and irregular ovals; Oval shape (miscellaneous overall shape)
26.17.09 - Bands, curved; Bars, curved; Curved line(s), band(s) or bar(s); Lines, curved
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