IC 040. US 100 103 106. G & S: Assembly for others of wafers, chips, semiconductors and integrated circuits; assembly for others of integrated circuits, masks, and electronic chips or computer chips; custom cutting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom photo lithograph printing of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom etching of wafers, chips, semiconductors and integrated circuits; custom thin filming of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom diffusion ion implanting of wafers, chips, semiconductors and integrated circuits to the order and specification of others; custom chemical mechanical polishing of wafers, chips, semiconductors and integrated circuits to the order and specification of others. FIRST USE: 19950526. FIRST USE IN COMMERCE: 20040430
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