(CANCELLED) IC 007. US 013 019 021 023 031 034 035. G & S: Semiconductor manufacturing machines and components thereof; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers
26.17.01 - Bands, straight; Bars, straight; Lines, straight; Straight line(s), band(s) or bar(s)
26.17.04 - Bands, vertical; Bars, vertical; Lines, vertical; Vertical line(s), band(s) or bar(s)
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