BGA
Serial Number: 75317317
Word Mark: BGA
Goods and Services: (ABANDONED) IC 001. US 001 005 006 010 026 046. G & S: thermoplastic and thermoset resins used for electronic computer chip packages; encapsulants and sealants made of silica and epoxy used as a protective coating for electronic components
Mark Drawing Code: (3) DESIGN PLUS WORDS, LETTERS, AND/OR NUMBERS
Design Search Code: 24.17.25 - Biohazard symbol; Degree sign (°); Equal sign (=); Greater than symbol > (mathematical); Handicapped symbol; Hazardous materials symbol; Less than symbol < (mathematical); Pound sign (#)
Filing Date: 06/30/1997
Current Basis: 1B
Original Filing Basis: 1B
Type of Mark: TRADEMARK
Register: PRINCIPAL
Live/Dead Indicator: DEAD
Prior Registrations: 2022668
SiteNo: 567469