Serial Number: 76057743

Reg Number: 3029558

Word Mark: ALPHA-FRY TECHNOLOGIES

Goods and Services: (CANCELLED) IC 001. US 001 005 006 010 026 046. G & S: CHEMICALS FOR USE IN THE MANUFACTURE AND ASSEMBLY OF PRINTED CIRCUITS, ELECTRONIC COMPONENTS AND SEMICONDUCTOR PACKAGES; CHEMICAL COMPOUNDS, NAMELY, RESIN COATINGS USED AS TEMPORARY SOLDER MASKS TO PREVENT THE ADHERENCE OF SOLDER TO BASE METAL FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; THERMOPLASTIC PASTE ADHESIVES FOR USE IN THE MANUFACTURE OF ELECTRONIC ASSEMBLIES; SOLDERING CHEMICALS, NAMELY, AQUEOUS MACHINE DESCALERS FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; CHEMICAL PREPARATIONS IN THE NATURE OF RUST INHIBITORS; SOLDERING FLUX; WATER SOLUBLE SOLDERING FLUX; LOW SOLIDS SOLDER FLUX; SOLDERING FLUX, ZINC CHLORIDE TYPE; SOLDER CHEMICALS AND ANTIOXIDANTS FOR USE WITH SOLDER; FLUXES USED FOR SOLDERING ELECTRONIC CIRCUITS, WHICH DO NOT REQUIRE CLEANING AFTER SAID USE; OXIDATION CHEMICALS FOR PROTECTING THE SURFACE TO WHICH THEY ARE APPLIED FOR USE IN CONNECTION WITH SOLDER; SILVER/GLASS DIE ATTACH MATERIAL ADHESIVES FOR USE IN SILICON CHIP BINDING; CHEMICAL PREPARATIONS FOR SOLDERING, NAMELY, SOLDERING INJECTION CHEMICALS TO REDUCE OXIDE FORMATION ON BRIDGE CONDUCTION LINES, SURFACE CONDITIONING CHEMICALS TO PREPARE SURFACES FOR SOLDERING; PROTECTIVE CHEMICAL COATINGS TO MAINTAIN SOLDERABILITY OF SURFACES; ULTRAVIOLET CURABLE POLYMERS FOR USE IN LEGEND INKS, SOLDER MASKS AND ETCHING/PLATING RESISTS; SOLDERING CHEMICALS, NAMELY, AQUEOUS RESIST STRIPPER FOR USE IN THE PRINTED CIRCUIT BOARD INDUSTRY. FIRST USE: 19980100. FIRST USE IN COMMERCE: 19980100

(CANCELLED) IC 003. US 001 004 006 050 051 052. G & S: ORGANIC SOLVENTS FOR CLEANING AND DEGREASING PRINTED CIRCUIT BOARDS; SOLDERING AND PRINTED CIRCUIT CHEMICALS, NAMELY, ALKALI CLEANERS, DEGREASING SOLVENTS, FLUX REMOVER, METAL CLEANER, PAINT STRIPPERS AND VARNISH REMOVER, WIRE STRIPPING PREPARATION FOR REMOVING INSULATION FROM METAL, SILK SCREEN INK REMOVER, SOLDER RESIST REMOVING PREPARATION; SOLVENT AND AQUEOUS CLEANERS TO REMOVE RESIDUES AND CONTAMINANTS BEFORE AND AFTER SOLDERING; CHEMICAL CLEANER AND ROSIN FLUX REMOVER FOR USE IN ROSIN MILDLY ACTIVATED PASTE APPLICATIONS, NAMELY, CLEANING COMPOUND FOR SOLDER PLATED PRINTED CIRCUITS. FIRST USE: 19980100. FIRST USE IN COMMERCE: 19980100

(CANCELLED) IC 006. US 002 012 013 014 023 025 050. G & S: TIN AND LEAD EUTECTIC SOLDER; WATER SOLUBLE ORGANIC FLUX CORED SOLDER WIRE; COATED METAL STRIP; SOLDERS COMPOSED PRIMARILY OF LEAD AND TIN; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER; LASER CUT METAL STENCILS FOR USE IN THE ASSEMBLY OF ELECTRONIC COMPONENTS; SOLDER METAL ALLOY THAT IS TREATED TO INHIBIT DROSS FORMATION AND INCREASE FLUIDITY FOR USE IN SOLDERING APPLICATIONS; PASTES CONTAINING METAL POWDER FOR USE IN COPPER BRAZING; FLUX CORED WIRE SOLDER FOR USE IN THE ELECTRONICS INDUSTRY. FIRST USE: 19980100. FIRST USE IN COMMERCE: 19980100

Mark Drawing Code: (1) TYPED DRAWING

Filing Date: 05/25/2000

Current Basis: 1A

Original Filing Basis: 1B

Owner: (REGISTRANT) Fry's Metals, Inc. CORPORATION DELAWARE 600 ROUTE 440 JERSEY CITY NEW JERSEY 07304

Attorney of Record: William M. Borchard

Disclaimer: NO CLAIM IS MADE TO THE EXCLUSIVE RIGHT TO USE "TECHNOLOGIES" APART FROM THE MARK AS SHOWN

Type of Mark: TRADEMARK

Register: PRINCIPAL

Live/Dead Indicator: DEAD

Prior Registrations: 0527348;0558345;0718422;0725328;1004419;1277584;1889587;AND OTHERS

SiteNo: 426527