IC 040. US 100 103 106. G & S: Etching processing in the semiconductor wafer; manufacture of semiconductor, Integrated circuit, Integrated circuit board and wafer specified in the standard from customers; semiconductor packaging processing in the nature of manufacturing services for others; etching processing in integrated circuits; semiconductor wafer-level processing; wafer foundry, namely, manufacturing of semiconductor wafers for others; integrated circuit packaging processing in the nature of manufacturing services for others; semiconductor substrate processing and manufacturing; substrate foundry, namely, manufacturing of semiconductor substrates for others; manufacture of semiconductor substrate. FIRST USE: 20120601. FIRST USE IN COMMERCE: 20120601
IC 042. US 100 101. G & S: Semiconductor related products technology research and development for others; Semiconductor packaging design; Integrated Circuit design; semiconductor substrate design; Quality inspection for semiconductors and related products; Testing for semiconductors and related products; quality identification for semiconductors and related products, namely, quality control for others. FIRST USE: 20120601. FIRST USE IN COMMERCE: 20120601
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