IC 040. US 100 103 106. G & S: Burnishing by abrasion; custom assembling of materials for others, namely, custom assembly of semiconductors and integrated circuits for others according to customer specifications, custom manufacture of semiconductors, integrated circuits, computer chips, and semiconductor wafers; soldering; grinding; treatment of metal; metal plating; key cutting
IC 042. US 100 101. G & S: Technical research, namely, research and development of new products for others; technological consultation services in the technology field of semiconductors, semiconductor wafers and integrated circuits; technical project studies, namely, providing technology consultation services for others in the field of semiconductor design and semiconductor engineering; research and development for others, namely, custom design and testing for new product development regarding electrical and electronic products, semiconductors, wafer and integrated circuits, design of photo masks for the production of integrated circuits for others; quality control testing of semiconductors and integrated circuits for others; material testing; packaging design services; computer programming for others; computer software design for others; computer system design for others
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